830nm-2W
The 830nm semiconductor laser is specially developed for thermal sensitive CTP digital plate making scenarios and is the core imaging light source for printing plate making. Based on the principle of 830nm infrared thermal imaging, laser focusing irradiates the thermal sensitive printing plate, accurately triggers the thermal chemical reaction of the coating, and achieves high-precision graphic and text dot forming. The product has the characteristics of stable power, uniform light spot, good wavelength consistency, and fast modulation response. The dot edge is clear and the tone restoration is stable. It is widely used in various plate making equipment such as newspapers, books, commercial color printing, packaging, etc. It supports single tube fiber coupling, multi-channel array integration, long service life, and easy maintenance. It is the preferred light source solution for thermal CTP plate making machines.Main features：
wavelength
830nm
output power
2W
fiber core diameter
50μm
Optical fiber numerical aperture
0.14 NA
Application：
Performance Parameter
Structure Size (mm)
Instructions for use
-Avoid eye and skin exposure to direct radiation during operation.
-ESD precautions must be taken during storage, transportation and operation.
-Short-circuit is required between pins during storage and transportation.
-Please connect pins to wires by solder instead of using socket when operation current is higher than 6A. Soldering point should be close to the middle of the pins. Soldering temperature should be lower than 260℃ and time shorter than 10 second.
-Make sure the fiber output end is properly cleaned before operation of laser. Follow safety protocols to avoid injury when handling and cutting the fiber.
-Use constant current power supply to avoid surge current during operation.
-Laser diode must be used according to the specifications.
-Laser diode must work with good cooling.
-Operation temperature ranges from 15℃ to 35℃ .
-Storage temperature ranges from -20℃ to +70℃.
-ESD precautions must be taken during storage, transportation and operation.
-Short-circuit is required between pins during storage and transportation.
-Please connect pins to wires by solder instead of using socket when operation current is higher than 6A. Soldering point should be close to the middle of the pins. Soldering temperature should be lower than 260℃ and time shorter than 10 second.
-Make sure the fiber output end is properly cleaned before operation of laser. Follow safety protocols to avoid injury when handling and cutting the fiber.
-Use constant current power supply to avoid surge current during operation.
-Laser diode must be used according to the specifications.
-Laser diode must work with good cooling.
-Operation temperature ranges from 15℃ to 35℃ .
-Storage temperature ranges from -20℃ to +70℃.
